Simulation

Simulation

We offer full-service signal integrity analysis, modelling, and test services for high-speed PCBs and backplanes. In addition to time and frequency domain measurements for impedance analysis, skew and propagation delay, loss measurements, and eye diagram analysis, experts also have experience with VNA test in development and production.

SI-Proficiency

FPGA’S, CPLD’S, ASIC’S, PROCESSORS & MICRO CTRLS ETHERNET 1G/10G, MMI, SGMII & RGMII DDR, DDR2, DDR3 & DDR4 FLASH, PROM, SRAM, DPRAM, BACKPLANE

eMMC, UFS, NAND Flash, NOR Flash, SPI ADC & DAC INTERFACES

MIPI, CSI, DSI, DP, QSPI

Layer stack up planning

Package extraction, Cable modelling

USB1, USB2, USB3, USB-OTG & HDMI, LVDS PCIe2/3/4/5 & SATA Gen 1/2/3, ROCKET IOS 3D VIA EXTRACTION MULTI BOARD SIMULATION

Signal Integrity Analysis

  • Pre-Layout Simulation
    • Reflection Analysis
    • Layout Guidelines
    • Suitable design topology
    • I/O Model definition
  • Post-Layout Simulation
    • Reflection Analysis
    • I/O Model definition
    • Simulation Report
    • Correlate with Pre-Layout Simulation
  • Freq-Domain Simulation
    • Insertion Loss
    • Return Loss
    • Mode Conversion
    • TDR Impedance
  • Via Modeling
  • Parallel Bus Analysis
    • DDRx Simulation
    • Setup & Hold time calculation
    • Reflection Analysis
  • SERDES Simulation
    • Eye Diagram Analysis
    • Jitter estimation
    • Electrical Compliance checks
  • Parasitic Extraction
    • RLGC calculation
  • DRC Rule Check (SI/PI/EMI aspects)
  • Multi-board simulation

POWER INTEGRITY ANALYSIS

  • DC Voltage (IR) Drop Simulation
    • Voltage drop plot
    • Current density plot
    • Via current plot
    • Current distribution plot
  • Decap Target Impedance Simulation
    • Impedance profile
    • Decap Optimization
    • Simulation Report
  • Plane Noise Analysis
  • Thermal-PI Co-simulation

THERMAL ANALYSIS

  • Temperature Distribution Plot
  • Heat Loss Plots
  • Thermal Gradient Plots
  • Thermal Flux Plots
  • Thermal Parameter Suggestion
    • Heat Sink Technology
    • Cooling Pipe
    • Environmental Conditions

EMI/EMC & Antenna Simulation

  • RF Layout simulation | Integrated level Simulations
  • Antenna Placement analysis | Performance optimization
  • Frontend S-Parameter | Matching network Optimization
  • EMI/EMC Simulation/Analysis | Problem Debug.
  • Link Budget Analysis | Cascade Analysis for RF Systems
  • Omni Directional, inverted-F, Printed antenna.
  • Antennas for wireless systems: BT, Wi-Fi, NFC, RFID, Sub-GHz
  • Passives - Diplexer, Power Combiners and power dividers

Interface Technologies

  • DDRx, SDRAM, eMMC, UFS, NAND Flash, NOR Flash, SPI, QSPI
  • LVDS
  • PCIe Gen2/3/4/5
  • USB2.0/3.0/3.1, USB-OTG
  • SATA Gen1/2/3
  • MIPI, CSI, DSI, DP, HDMI
  • Ethernet 1G/10G
  • RF Channels