PCB Design Service

PCB Design Services

A brand-new product concept?

The PCB design & layout services offered by the technical team at Rantronics will be of the greatest calibre. We provide more than just a universally applicable answer. Before we start designing a PCB, we thoroughly analyze its requirements and purpose to make sure it is cost-efficient, functional, and designed for manufacture.

  • Design for Manufacturability
  • Design for Environment
  • Cost-Effective Design
  • Turnkey Development
  • Experienced In-house Engineering Team

Industrial applications

  • Industrial Electronics
  • Mobile and Telecommunication
  • Consumer Electronics
  • Medical
  • Defense
  • Aerospace
  • Semiconductor
  • Automotive

Technology Proficiency

  • Ethernet 10G Over Backplane
  • PCIe Switches / Controllers
  • IB and BXI offset 11.3 angle routing
  • Noise reduction techniques and emission of heat control.
  • Flex and Rigid PCB
  • 1/10G Line Card , Bluetooth, Ethernet &Wi- Fi.
  • SERDES, SRIO, GPS & RF.
  • PCI Express, PCI Express 2.0, PCI Express 3.0
  • ADC and DAC converter.
  • Handled Up to 100 Gbps DDR2,3&4, QDR, SRAM, LPDDR.
  • PXIE, QPI, IB and BXI.
  • HDMI, SATA, SGMII, USB
  • USB, SATA Gen1/2/3, HDMI
  • PCI Express Gen2/3/4
  • DDR4/3/2, RLDRAM, QDR, LPDDR4/3

CHIPSET IMPLEMENTATION

  • Xilinx 5, 6 and 7 Series (Kintex, Virtex, Artix)
  • RZ/G Series (Cortex-A53)
  • Xilinx UltraScale and UltraScale+ FPGAs
  • Xilinx Zynq UltraScale+ MPSoC

Design capabilities

  • Back drill, Blind and Buried vias.
  • Design support for DFA, DFM & DFT.
  • DFA & DFM support for Penalization.
  • Layer stack-up building support for high speed design.
  • Proper analysis of component placement mixed layout (Analog, Digital & Power supply).
  • Well Rule setup for Design.
  • Feasibility Analysis for product development time allocation.
  • Data base Library management and development. (Fine pitches components BGA, LGA, QFN, PQFP and etc.)
  • Physical PCB analysis for Reverse Engineering (Single & Double layer).
  • Controlled impedance and proper Analysis.

Our design process

> IPC – 7351B Complaint

> Mechanical - PCB

> Stack-up

> Placement & Routing

> Simulation

> Gerber generation

> Fabrication

> Assembly

> Testing

PCB Projects

NETWORK BASED PROJECT

Board Size : 160 x 230mm

Layers : 24

No of Components : 1264

Total Nets : 1658

Total Connections : 4972

PCB Thickness : 1.8mm

Material : FR4

Via : Micro, Blind & Buried with staggered Via.

Back Drill Technology : Yes

Min Trace width : 4 mils

Min Spacing : 4 mils

Impedance : Yes

High speed Interfaces : 0.5mm pitch 1152 pins & 1mm pitch , 484 pins FBGA , DDR4, PCIe4, USB3, VME Connector 160 pins and PMIC section’s

CPU BASED PROJECT

Board Size : 180 x 160mm

Layers : 22

No of Components : 1359

Total Nets : 1083

Total Connections : 5935

PCB Thickness : 2mm

Material : FR4

Via : Micro, Blind & Buried with stacked Via.

Back Drill Technology : Yes

Min Trace width : 3.5 mils

Min Spacing : 4 mils

Impedance : Yes

High speed Interfaces : 0.35mm pitch FBGA (Processor), DDR4, PCIe4, USB3, SATA, RJ45, Hirose Connector and PMIC section’s

PCIe NVMe SSDs

Board Size: 95 x 95 mm

Layers: 22

No of Components: 1101

Total Nets: 765

Total Connections: 4559

PCB Thickness: 2.099mm

Material: FR4

Via: BB Via, Through Hole Via

Back Drill Technology: Yes

Min Trace width: 2.83 mils

Min Spacing: 3 mils

Major Components: FCBGA_1156 Xilinx, 64 bit_DDR4, 16_Nand Flash Memory, PCIe Gen4, Ethernet, UCB 3.0, Buck Booster, PMIC connector, and etc.

MIS500-CIU-SoM

Board Size: 67 x 65 mm

Layers: 16

No of Components: 331

Total Nets: 431

Total Connections: 1466

PCB Thickness: 2.099 mm

Material: FR4

Via: BB Via, Through Hole Via

Back Drill Technology: Yes

Min Trace width: 2.15 mils

Min Spacing: 3.5 mils

Major Components: 784_FCBGA_Cortex, 200-TFBGA_DDR4 8 bit parallel, Ethernet FBGA_152, PCIe Connector-4

Storage and Networking

Board Size: 64 x 97 mm

Layers: 22

No of Components: 1061

Total Nets: 773

Total Connections: 4119

PCB Thickness: 2.099 mm

Material: FR4

Via: BB Via, Through Hole Via

Back Drill Technology: Yes

Min Trace width: 2.15 mils

Min Spacing: 3.5 mils

Major Components: FCBGA_1760 INTEL, 64 bit_DDR4, 16_Nand Flash Memory Connector, PCIe Gen4, Ethernet, UCB 3.0, Buck Booster, PMIC connector, and etc.